Optimizing the Structural Design of Computing Units in Autonomous Driving Systems and Electric Vehicles to Enhance Overall Performance Stability

Abstract

In the rapid development of autonomous driving systems and electric vehicles, the thermal management of computing units has become a key factor affecting system performance and stability. This article explores how to enhance the heat dissipation efficiency of computing units through optimized structural design, thereby enhancing the overall performance stability. Firstly, aluminum alloy casings are an ideal material choice for computing units due to their excellent thermal conductivity, lightweight characteristics, and processing flexibility. We analyze the heat conduction mechanisms in detail and consider design based on thermal conductivity formulas. To improve heat dissipation efficiency, we adopt a fin design that increases the heat dissipation surface area, utilizing air convection to accelerate heat dissipation. We also discuss the design of fin sizes and spacing, aiming to balance the molding process's feasibility and heat dissipation efficiency. Secondly, the structural optimization of the heat dissipation module is conducted by integrating the material characteristics of copper blocks with those of aluminum alloy casings. We propose a "disassembly" design concept, considering the use of localized materials to enhance thermal conduction efficiency. For areas with high heat generation from electronic components, the high thermal conductivity of copper blocks quickly transfers heat to the aluminum alloy casing, achieving a cooling effect. Furthermore, when the aforementioned heat dissipation methods are insufficient to meet higher cooling demands, liquid cold plate technology may become an effective cooling solution. By integrating the liquid cooling system of the computing unit with the cooling system of the electric vehicle battery pack, we can achieve thermal load balancing, enhancing the system's energy efficiency and stability. This multifunctional cooling system maximizes the utilization of internal vehicle space while improving thermal management efficiency, catering to the high-performance demands of electric vehicles and autonomous driving systems. This study proposes diversified solutions for the thermal design of computing units in autonomous driving systems and electric vehicles, aiming to enhance the performance and stability of the computing units. Through the integrated use of fin design, optimization of cooling modules, and liquid cold plate technology, it provides effective and economical management strategies for the thermal management of future electronic devices, with broad application prospects.